Memory Design Chips Set to Grow Strongly in the Next Decade

Semiconductor makers are turning to specialised memory building blocks, called IP, to keep up with the rising complexity of their devices. In 2025 these blocks were worth about 645 million dollars, and experts expect the value to climb to roughly 784 million by 2035. That rise averages just under two percent each year over the next decade. The push comes from several fast‑moving fields. Artificial‑intelligence systems, cloud servers, cars with smart electronics and high‑performance computing all need memory that works fast while staying small and low‑power. Designers now prefer IP solutions that fit neatly into system‑on‑chip (SoC) designs, especially as manufacturers move to finer manufacturing steps. Key players in the market include Arm Holdings, Synopsys, Cadence, and Siemens EDA, among others. The industry is split into different memory types—such as static RAM (SRAM), read‑only memory (ROM), magnetoresistive RAM (MRAM) and other non‑volatile options. SRAM remains the most common, but MRAM is gaining traction because it can hold data without power and still move quickly. Applications also shape demand. Consumer gadgets—phones, wearables, smart home devices—dominate the market today. Yet the industrial and Internet‑of‑Things segment is expected to grow fastest, driven by automation and edge computing. Meanwhile, the size of the memory cells is shrinking; the segment that uses nodes 28 nm to 40 nm leads now, but the tiniest nodes (≤14 nm) are growing fastest as AI chips become more popular.

When it comes to how the IP is delivered, most designers still buy “hard” blocks—ready‑to‑use components that fit easily into their layout. However, newer modular designs called chiplets or 3‑D die‑level IP are rising quickly because they let engineers mix and match parts from different suppliers. Regionally, Asia‑Pacific is the biggest market, taking up about 40 % of global sales in 2025. China, Taiwan, South Korea and Japan supply most of the chips, thanks to strong local manufacturing and government support for AI and automotive projects. North America also holds a solid share, thanks to leading design firms and advanced research labs that push AI and cloud technologies forward. In early 2026 Cadence announced a new DSP core that cuts power use while doubling compute speed for AI chips. A month later, TSMC and Synopsys teamed up to create a memory compiler that works well on advanced nodes, helping designers bring next‑generation chips faster. The market study also dives into technical details that help companies decide which IP to buy. It looks at memory density, speed, power use, how well the IP scales to smaller nodes, and how easy it is to integrate into a full chip. For companies that need custom solutions, the report offers insights into design automation and testing methods. Overall, as devices become smarter and slimmer, the demand for efficient memory building blocks will keep rising, offering both opportunities and challenges for chip designers worldwide.

Actions